Powertech eyes world's first panel-level packaging for AI chips in 2027

SemiconductorsAMD, Broadcom likely among first adopters as Taiwan supplier plans $2.2bn investmentPowertech's schedule would put it ahead of TSMC in adopting the next-generation of packaging technology for AI chips. (Photo by Cheng Ting-Fang and Powertech Technology's website)CHENG TING-FANGAugust 27, 2026 11:08 JSTHSINCHU, Taiwan -- Taiwan's Powertech Technology says it will start production at the world's first panel-level chip packaging facility for AI chips as soon as early 2027 to make server central processing units, artificial intelligence computing chips and advanced optics.